Overview
The uLED Panel AA Platform aligns and bonds micro-LED panels using live colorimetric feedback — alignment converges on measured optical performance, not mechanical datums. A fully integrated process flow (dispense → align → cure → verify) runs in one enclosure, and dual material-handling systems keep the alignment stage saturated for maximum output.
Key Features
- Measurement-first alignment. 20+ configurable image-qualification items are evaluated at the alignment stage and can be tailored to production-line requirements—helping detect defects before bonding rather than at final test.
- Colorimeter-guided 6DoF motion. Sub-micron linear and milli-degree angular convergence on live optical measurement.
- Dual MHS parallel processing. Two material-handling systems overlap load/unload with alignment for +30% capacity.
- Integrated dispense & cure. Precision adhesive dispensing and staged curing inside the alignment loop.
- Production software. Recipe management, full per-unit traceability, and line-integration interfaces [SECS/GEM optional].
Applications
- uLED panel-to-optics alignment
- uLED display module-to-waveguide alignment & bonding
- Panel-level precision optical assembly [custom formats on request]
Photo: integrated system with dual MHS configuration.
System Modules
Colorimeter Head
Camera + lens metrology for luminance, chromaticity, and uniformity at alignment.
6DoF Platform
X/Y/Z + θx/θy/θz precision stack, sub-μm resolution.
Dispense & PnP Station
Adhesive dispensing and pick-and-place in the same process loop.
Dual MHS + Storage
Parallel material handling with LED storage system.
